Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US12094494Application Date: 2006-09-29
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Publication No.: US07989964B2Publication Date: 2011-08-02
- Inventor: Hiroki Matsunaga , Akihiro Maejima , Jinsaku Kaneda , Hiroshi Ando , Eisaku Maeda
- Applicant: Hiroki Matsunaga , Akihiro Maejima , Jinsaku Kaneda , Hiroshi Ando , Eisaku Maeda
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-056575 20060302
- International Application: PCT/JP2006/319535 WO 20060929
- International Announcement: WO2007/099664 WO 20070907
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
On a semiconductor chip in a semiconductor integrated circuit, a plurality of circuit cells each of which has a pad are formed along a first chip side of the semiconductor chip. Among the plurality of circuit cells, one or more circuit cells at least in the vicinity of an end portion on the first chip side are arranged having a steplike shift in a direction apart from the first chip side with decreasing distance from the center portion to the end portion on the first chip side.
Public/Granted literature
- US20090273099A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2009-11-05
Information query
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