Invention Grant
- Patent Title: Carbon nanotube circuit component structure
- Patent Title (中): 碳纳米管电路元件结构
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Application No.: US11563215Application Date: 2006-11-27
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Publication No.: US07990037B2Publication Date: 2011-08-02
- Inventor: Mou-Shiung Lin , Chien-Kang Chou , Hsin-Jung Lo
- Applicant: Mou-Shiung Lin , Chien-Kang Chou , Hsin-Jung Lo
- Applicant Address: TW Hsinchu
- Assignee: Megica Corporation
- Current Assignee: Megica Corporation
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery, LLP
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
The present invention proposes a circuit component structure, which comprises a semiconductor substrate, a fine-line metallization structure formed over the semiconductor substrate and having at least one metal pad, a passivation layer formed over the fine-line metallization structure with the metal pads exposed by the openings of the passivation layer, at least one carbon nanotube layer formed over the fine-line metallization structure and the passivation layer and connecting with the metal pads. The present invention is to provide a carbon nanotube circuit component structure and a method for fabricating the same, wherein the circuit of a semiconductor element is made of an electrically conductive carbon nanotube, and the circuit of the semiconductor element can thus be made finer and denser via the superior electric conductivity, flexibility and strength of the carbon nanotube.
Public/Granted literature
- US20070164430A1 CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE Public/Granted day:2007-07-19
Information query
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