A temperature compensation attenuator formed from a base, a serial film thermistor having two ends, a parallel film resistor, an input terminal, and an output terminal. The serial film thermistor and the parallel film resistor are disposed on the base, the input terminal and the output terminal are connected to the two ends of the serial film thermistor. The temperature compensation attenuator features a small size, good RF performance and simple production, and solves the problem of easy detachment of discrete components from the attenuator.