Invention Grant
- Patent Title: Device protection using temperature compensation
- Patent Title (中): 器件保护采用温度补偿
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Application No.: US12154328Application Date: 2008-05-22
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Publication No.: US07990668B2Publication Date: 2011-08-02
- Inventor: Timothy Robert Day , Daniel Patrick Roth
- Applicant: Timothy Robert Day , Daniel Patrick Roth
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: King & Spalding LLP
- Main IPC: H02H3/00
- IPC: H02H3/00 ; H02H7/00

Abstract:
Device protection using temperature compensation. A logic module associated with groups of capacitors adjusts complex impedance planes associated with the capacitor groups to account for ambient temperature variations. In particular, the logic module is configured to adjust a center of a circle of each complex impedance plane based on an average impedance. The average impedance for a selected capacitor group includes impedance measurements for groups other than the selected group, to prevent capacitor failures in that group from skewing the average. The logic module can adjust the circle center in response to changes in average impedance over periods of time. For example, the logic module can filter measured differences in average impedance using a low pass filter, to distinguish slow impedance changes caused by temperature variations and rapid impedance changes caused by capacitor failures. The logic module can adjust the circle center in accordance with the filtered difference value.
Public/Granted literature
- US20080291593A1 Device protection using temperature compensation Public/Granted day:2008-11-27
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