Invention Grant
- Patent Title: Electronic device with hinged cover
- Patent Title (中): 带铰链盖的电子设备
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Application No.: US12508590Application Date: 2009-07-24
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Publication No.: US07990692B2Publication Date: 2011-08-02
- Inventor: Wei-Jun Wang
- Applicant: Wei-Jun Wang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent Zhigang Ma
- Priority: CN200810306584 20081227
- Main IPC: H05K7/12
- IPC: H05K7/12
Abstract:
An electronic device includes a main body, a cover, and two supports. The main body defines two receiving slots. The cover is hinged on the main body. The supports are slidably connected to the main body, capable of being entirely received in the receiving slots or protruding out of the main body, in response to positions of the cover.
Public/Granted literature
- US20100165558A1 ELECTRONIC DEVICE WITH HINGED COVER Public/Granted day:2010-07-01
Information query
