Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US12509169Application Date: 2009-07-24
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Publication No.: US07990700B2Publication Date: 2011-08-02
- Inventor: Lei Guo
- Applicant: Lei Guo
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent D. Austin Bonderer
- Priority: TW10302522.5A 20090525
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An apparatus includes a side plate and a rear plate perpendicular to the side plate. A motherboard is mounted on the side plate. The motherboard has a heat source attached thereon. The rear plate defines a ventilation area. The ventilation and the heat source are located at different heights. A fan is mounted on the ventilation area. The fan inclines towards the plurality of expansion cards.
Public/Granted literature
- US20100296237A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2010-11-25
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