Invention Grant
- Patent Title: Optical module
- Patent Title (中): 光模块
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Application No.: US12189868Application Date: 2008-08-12
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Publication No.: US07991029B2Publication Date: 2011-08-02
- Inventor: Hiroshi Aruga
- Applicant: Hiroshi Aruga
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2007-306011 20071127
- Main IPC: H01S3/04
- IPC: H01S3/04
Abstract:
A cut-out portion of a ground conductor is located in a region where a header faces a flexible board from the junction of a signal pin and a signal line and faces the signal line. The size of the cut-out portion is determined so that the impedance of the signal pin is matched to the impedance of the signal line.
Public/Granted literature
- US20090135864A1 OPTICAL MODULE Public/Granted day:2009-05-28
Information query
