Invention Grant
US07991045B2 Device and method for testing signal-receiving sensitivity of an electronic subassembly 失效
用于测试电子组件的信号接收灵敏度的装置和方法

  • Patent Title: Device and method for testing signal-receiving sensitivity of an electronic subassembly
  • Patent Title (中): 用于测试电子组件的信号接收灵敏度的装置和方法
  • Application No.: US11308933
    Application Date: 2006-05-29
  • Publication No.: US07991045B2
    Publication Date: 2011-08-02
  • Inventor: Shou-Kuo Hsu
  • Applicant: Shou-Kuo Hsu
  • Applicant Address: TW Tu-Cheng, New Taipei
  • Assignee: Hon Hai Precision Industry Co., Ltd.
  • Current Assignee: Hon Hai Precision Industry Co., Ltd.
  • Current Assignee Address: TW Tu-Cheng, New Taipei
  • Agent Wei Te Chung
  • Priority: CN200510035299 20050610; CN200510036094 20050718; CN200510100037 20050928
  • Main IPC: H04B3/46
  • IPC: H04B3/46 G01R31/08 G10L19/00
Device and method for testing signal-receiving sensitivity of an electronic subassembly
Abstract:
A device and a method for testing signal-receiving sensitivity of an electronic subassembly are provided. The device includes a control board and a computer. The control board is connected to the electronic subassembly. The computer is connected to the control board and also connected to the electronic subassembly. Wherein signals sent by the computer are compared with signals received by the computer for adjusting predetermined parameters associated with the signal-receiving sensitivity.
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