An insert high fidelity earphone is provided in which a hollow housing is connected to two tubes. A first tube is connected to the hollow housing on one side, and on the other side is inserted into an ear tip that ensures substantial sealing of the ear canal. A second tube is connected to hollow housing on one side and houses a cable that connects circuitry in the hollow housing to an audio source. The first tube comprises a damping assembly. The first tube comprises grooves on the inside wall that ensure that the damping assembly only fits in one orientation, which is the correct orientation. The damping assembly may be easily replaceable, without having to replace the entire earphone. The earphone may have a curved shape providing a comfortable and nearly invisible fit into the ear canal.