Invention Grant
US07991218B2 Pattern matching apparatus and semiconductor inspection system using the same
有权
模式匹配装置和半导体检测系统采用相同的方式
- Patent Title: Pattern matching apparatus and semiconductor inspection system using the same
- Patent Title (中): 模式匹配装置和半导体检测系统采用相同的方式
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Application No.: US11588418Application Date: 2006-10-27
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Publication No.: US07991218B2Publication Date: 2011-08-02
- Inventor: Yasutaka Toyoda , Takumichi Sutani , Ryoichi Matsuoka
- Applicant: Yasutaka Toyoda , Takumichi Sutani , Ryoichi Matsuoka
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-314853 20051028
- Main IPC: G06K9/62
- IPC: G06K9/62

Abstract:
Solving means is configured of a signal input interface, a data calculation unit, and a signal output interface. The signal input interface allows image data which is obtained by photographing hole patterns, and CAD data which corresponds to hole patterns included in the image data, to be inputted. The data calculation unit includes: CAD hole-pattern central-position detection means which detects central positions respectively of hole patterns included in the CAD data from the CAD data, and which generates data which represents, with an image, the central positions of the respective hole patterns; pattern extraction means which extracts pattern data from the image data; image hole-pattern central-position detection means which detects central positions of the respective hole patterns in the image data from the pattern data, and which generates data which represents, with an image, the central positions of these hole patterns detected from the image data; and collation process means which detects positional data in the image data corresponding to that in the CAD data through a process of collating the CAD hole-pattern central-position data with the image hole-pattern central-position data. The signal output interface outputs the positional data outputted from the data calculation unit.
Public/Granted literature
- US20070098248A1 Pattern matching apparatus and semiconductor inspection system using the same Public/Granted day:2007-05-03
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