Invention Grant
US07991475B1 High density micromachined electrode arrays useable for auditory nerve implants and related methods
有权
高密度微加工电极阵列可用于听觉神经植入物及相关方法
- Patent Title: High density micromachined electrode arrays useable for auditory nerve implants and related methods
- Patent Title (中): 高密度微加工电极阵列可用于听觉神经植入物及相关方法
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Application No.: US11450965Application Date: 2006-06-08
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Publication No.: US07991475B1Publication Date: 2011-08-02
- Inventor: William C. Tang , Jian Wu , Ryan Hainley
- Applicant: William C. Tang , Jian Wu , Ryan Hainley
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Stout, Uxa, Buyan & Mullins
- Agent Robert D. Buyan
- Main IPC: A61N1/05
- IPC: A61N1/05
Abstract:
Devices, systems and methods that comprise or utilize implantable electrode arrays for neural stimulation and/or sensing. In some embodiments, the electrode array is implanted or inserted into the auditory nerve and is used to deliver electrical impulses to/receive data from the auditory nerve in the treatment of hearing disorders.
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