Invention Grant
US07991934B2 Multiprocessor method and system using stacked processor modules and board-to-board connectors
有权
多处理器方法和使用堆叠处理器模块和板对板连接器的系统
- Patent Title: Multiprocessor method and system using stacked processor modules and board-to-board connectors
- Patent Title (中): 多处理器方法和使用堆叠处理器模块和板对板连接器的系统
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Application No.: US12558255Application Date: 2009-09-11
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Publication No.: US07991934B2Publication Date: 2011-08-02
- Inventor: Li Yao , Wei Chen
- Applicant: Li Yao , Wei Chen
- Applicant Address: CN Shenzhen
- Assignee: Shenzhen Mindray Bio-Medical Electronics Co., Ltd.
- Current Assignee: Shenzhen Mindray Bio-Medical Electronics Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Stoel Rives LLP
- Agent Kory D. Christensen
- Priority: CN200610034808 20060329
- Main IPC: G06F13/00
- IPC: G06F13/00

Abstract:
A multiprocessor system is provided, comprising a baseboard, for arranging peripheral equipments; and a plurality of processor modules, each equipped with a processor and a board-to-board connector; wherein the plurality of processor modules are stacked up, with board-to-board connectors being electrically connected between the processor modules and between the processor modules and the baseboard; the processors communicate with the peripheral equipments in accordance with a specific bus specification; and the operations of the plurality of processor modules are coordinated by routes provided between the processor modules and between the processor modules and the baseboard.
Public/Granted literature
- US20100042810A1 MULTIPROCESSOR METHOD AND SYSTEM USING STACKED PROCESSOR MODULES AND BOARD-TO-BOARD CONNECTORS Public/Granted day:2010-02-18
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