Invention Grant
US07992287B2 System for thinning a transducer with improved thickness uniformity
有权
用于减薄厚度均匀性的传感器的系统
- Patent Title: System for thinning a transducer with improved thickness uniformity
- Patent Title (中): 用于减薄厚度均匀性的传感器的系统
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Application No.: US11982948Application Date: 2007-11-06
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Publication No.: US07992287B2Publication Date: 2011-08-09
- Inventor: Pinyen Lin , John Richard Andrews
- Applicant: Pinyen Lin , John Richard Andrews
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Maginot, Moore & Beck LLP
- Main IPC: G11C5/12
- IPC: G11C5/12

Abstract:
A system for fabricating a transducer for an ink jet imaging device comprises a transducer assembly including a transducer overlying at least a portion of a flexible carrier. The transducer has a top surface extending a first distance from the carrier. A spacer overlies a portion of the carrier not covered by the transducer. The spacer has a top surface extending a second distance form the carrier. The second distance is less than the first distance and corresponds to a target thickness for the transducer. A lapping tool is configured to lap the top surface of the transducer. The system includes a detector for detecting when the lapping tool contacts the lapping spacer.
Public/Granted literature
- US20090113710A1 Method for fabricating a transducer with improved thickness uniformity Public/Granted day:2009-05-07
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