A system for removing connector pins from a backplane comprises at least two clamp plates and a plurality of pin plates coupled between the clamp plates, the pin plates configured to be positioned between adjacent rows of the connector pins. The system further comprises a tightening mechanism to tighten the clamp plates and the pin plates around the connector pins. In some embodiments, the system comprises a frame assembly configured to be positioned over the clamp plates, and configured to pull the clamp plates, the pin plates, and the connector pins off of the circuit board.