Invention Grant
- Patent Title: Method of manufacturing an interconnect device which forms a heat sink and electrical connections between a heat generating device and a power source
- Patent Title (中): 制造互连装置的方法，其形成散热器和发热装置与电源之间的电连接
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Application No.: US12126635Application Date: 2008-05-23
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Publication No.: US07992294B2Publication Date: 2011-08-09
- Inventor: Victor Zaderej , Kevin O'Connor , Charlie Manlapaz , Timothy Hagan , Samuel C. Ramey
- Applicant: Victor Zaderej , Kevin O'Connor , Charlie Manlapaz , Timothy Hagan , Samuel C. Ramey
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10
Abstract:
An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.
Public/Granted literature
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