Invention Grant
- Patent Title: Expansion valve with piezo material
- Patent Title (中): 带压电材料的膨胀阀
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Application No.: US11332897Application Date: 2006-01-17
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Publication No.: US07992395B2Publication Date: 2011-08-09
- Inventor: Ming Zhang , Sesha C. Madireddi , Byeongchul Na
- Applicant: Ming Zhang , Sesha C. Madireddi , Byeongchul Na
- Applicant Address: US MO Bridgeton US PA State College
- Assignee: Hussmann Corporation,Omega Piezo Technologies, Inc.
- Current Assignee: Hussmann Corporation,Omega Piezo Technologies, Inc.
- Current Assignee Address: US MO Bridgeton US PA State College
- Agency: Michael Best & Friedrich LLP
- Main IPC: F25B1/00
- IPC: F25B1/00

Abstract:
A method and system of controlling the temperature of a refrigeration system. In an embodiment, an expansion valve for a refrigeration system comprises an entry portion, an exit portion, and a flow control portion including a piezo material. The entry portion is configured to allow refrigerant to flow into the expansion valve. The exit portion is configured to allow refrigerant to flow from the expansion valve. The flow control portion is disposed between the entry portion and the exit portion, and is configured to control a volume of refrigerant that passes through the expansion valve.
Public/Granted literature
- US20070163297A1 Expansion valve with piezo material Public/Granted day:2007-07-19
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