Invention Grant
- Patent Title: Mechanical-quantity measuring device
- Patent Title (中): 机械量测量装置
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Application No.: US11709075Application Date: 2007-02-20
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Publication No.: US07992448B2Publication Date: 2011-08-09
- Inventor: Hiromi Shimazu , Hiroyuki Ohta , Yohei Tanno
- Applicant: Hiromi Shimazu , Hiroyuki Ohta , Yohei Tanno
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2006-089834 20060329
- Main IPC: G01L1/18
- IPC: G01L1/18 ; G01L1/22

Abstract:
A mechanical-quantity measuring device capable of measuring a strain component in a specific direction with high precision is provided.At least two or more pairs of bridge circuits are formed inside a semiconductor monocrystal substrate and a semiconductor chip, and one of these bridge circuits forms a n-type diffusion resistor in which a direction of a current flow and measuring variation of a resistor value are in parallel with a direction of the semiconductor monocrystal silicon substrate, and an another bridge circuit is composed of combination of p-type diffusion resistors in parallel with a direction.
Public/Granted literature
- US20070228500A1 Mechanical-Quality measuring device Public/Granted day:2007-10-04
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