A plate workpiece processing method includes utilizing one or more cutting devices of a machine tool to perform first and second cutting operations on a plate workpiece. During the first cutting operation, the workpiece is moved relative to cutting device(s) used for the first cutting operation, at least two cut-outs are partially formed in the workpiece with only a common residual connection left that jointly connects the partially formed cut-outs to a remaining portion of the workpiece and that is shortened along one or more cutting lines of the second cutting operation to a size that is larger than a working area of the cutting device(s) used for the second cutting operation. During the second cutting operation, the workpiece is maintained stationary supported by the machine tool, the shortened common residual connection is severed along the cutting line(s) to completely separate the cut-outs from the remaining portion of the workpiece.