Invention Grant
- Patent Title: Apparatus for cutting substrate and method thereof
- Patent Title (中): 基板切割装置及其方法
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Application No.: US11165177Application Date: 2005-06-24
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Publication No.: US07992482B2Publication Date: 2011-08-09
- Inventor: Jung Sik Kim
- Applicant: Jung Sik Kim
- Applicant Address: KR Seoul
- Assignee: LG Display Co., Ltd.
- Current Assignee: LG Display Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP.
- Priority: KR10-2004-0112867 20041227
- Main IPC: B26D3/08
- IPC: B26D3/08 ; B26D7/06 ; B26D7/02
Abstract:
An apparatus for cutting a substrate includes first and second belt conveyers for conveying the substrate thereon, a scriber for scribing the substrate along a cutting-reserved line, the scriber provided between the first and second belt conveyers and being spaced apart from the first and second belt conveyers, and a substrate support for securing the substrate, the substrate support provided between the first and second belt conveyers along a scribing direction of the substrate.
Public/Granted literature
- US20060150788A1 Apparatus for cutting substrate and method thereof Public/Granted day:2006-07-13
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