Invention Grant
- Patent Title: Heat sink module
- Patent Title (中): 散热模块
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Application No.: US12324872Application Date: 2008-11-27
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Publication No.: US07992624B2Publication Date: 2011-08-09
- Inventor: Tsung-Hsien Huang
- Applicant: Tsung-Hsien Huang
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Main IPC: F28F7/00
- IPC: F28F7/00

Abstract:
A heat sink module includes a heat transfer tube, a plurality of radiation fins respectively riveted to locating grooves around the periphery of the heat transfer tube, and a heat transfer panel fastened to the bottom side of the heat transfer tube and the radiation fin set and kept in contact with a heat source, such as a CPU or a light emitting unit of a LED lamp for transferring heat from the heat source to the radiation fins for quick dissipation.
Public/Granted literature
- US20100126697A1 HEAT SINK MODULE Public/Granted day:2010-05-27
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