Invention Grant
- Patent Title: Fluid ejecting apparatus
- Patent Title (中): 流体喷射装置
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Application No.: US12169875Application Date: 2008-07-09
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Publication No.: US07992987B2Publication Date: 2011-08-09
- Inventor: Satoru Hosono
- Applicant: Satoru Hosono
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2007-180870 20070710
- Main IPC: B41J2/18
- IPC: B41J2/18

Abstract:
A fluid ejecting apparatus that ejects a fluid includes a storage portion that stores a fluid, a head, and a head capping device. The head discharges fluid supplied from the storage portion from a plurality of nozzles and includes a fluid discharging passage through which other fluid is discharged from the storage portion. The head capping device contacts the head and receives the fluid discharged from the plurality of nozzles and the fluid discharged through the fluid discharging passage. The head and the head capping device respectively include a head side flow passage and a head capping device side flow passage, which cooperatively form a circulation flow passage, through which the fluid that flows from the storage portion through the nozzles and the fluid discharged through the fluid discharging passage are returned back to the storage portion, in a state where the head capping device contacts the head.
Public/Granted literature
- US20090015643A1 FLUID EJECTING APPARATUS Public/Granted day:2009-01-15
Information query
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