Invention Grant
US07993092B2 Moving carrier for lead frame and method of moving lead frame using the moving carrier
失效
用于引线框的移动载体和使用移动载体移动引线框架的方法
- Patent Title: Moving carrier for lead frame and method of moving lead frame using the moving carrier
- Patent Title (中): 用于引线框的移动载体和使用移动载体移动引线框架的方法
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Application No.: US12190426Application Date: 2008-08-12
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Publication No.: US07993092B2Publication Date: 2011-08-09
- Inventor: Yibo Liu , Qiang Chen
- Applicant: Yibo Liu , Qiang Chen
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: CN200710143604 20070814
- Main IPC: B65G1/133
- IPC: B65G1/133

Abstract:
Provided are a moving carrier for a lead frame, and a method of moving a lead frame using the moving carrier. The moving carrier includes a base which supports the lead frame including a body and a chip attach pad on which a chip is disposed. The moving carrier includes a groove portion which is integrated with a part of the base and contains the chip attach pad of the lead frame. The lead frame is inserted or withdrawn into or out from a magazine using the moving carrier and thus without deformation of the lead frame or damage to the chip.
Public/Granted literature
- US20090047111A1 MOVING CARRIER FOR LEAD FRAME AND METHOD OF MOVING LEAD FRAME USING THE MOVING CARRIER Public/Granted day:2009-02-19
Information query
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