Invention Grant
- Patent Title: Card edge module connector assembly
- Patent Title (中): 卡边模块连接器总成
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Application No.: US12371702Application Date: 2009-02-16
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Publication No.: US07993147B2Publication Date: 2011-08-09
- Inventor: Jordan Marshall Cole , Brian Patrick Costello
- Applicant: Jordan Marshall Cole , Brian Patrick Costello
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A connector assembly includes a housing and contacts. The connector includes a mounting face and a mating face disposed transverse to one another. The mounting face is used to mount the connector to a substrate. The mating face has an elongated slot that is configured to receive a mating edge of a card edge module. The contacts extend between opposite contact tips at each of the mounting face and the mating face. The contact tips at the mounting face are configured to electrically couple the connector with the substrate. The contact tips at the mating face are configured to electrically couple the connector with the card edge module. The card edge module is oriented transverse to the substrate when the card edge module mates with the connector.
Public/Granted literature
- US20100210123A1 CARD EDGE MODULE CONNECTOR ASSEMBLY Public/Granted day:2010-08-19
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