- Patent Title: Solid electrolytic capacitor and method of manufacturing the same
-
Application No.: US12689866Application Date: 2010-01-19
-
Publication No.: US07993418B2Publication Date: 2011-08-09
- Inventor: Hee Sung Choi , Seoung Jae Lee , Yeoung Jin Lee , Sung Han Won , Ha Yong Jung , Hyun Ho Shin , Jung Tae Park , Jae Youn Jeong
- Applicant: Hee Sung Choi , Seoung Jae Lee , Yeoung Jin Lee , Sung Han Won , Ha Yong Jung , Hyun Ho Shin , Jung Tae Park , Jae Youn Jeong
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2007-0132563 20071217
- Main IPC: H01G9/00
- IPC: H01G9/00

Abstract:
Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.
Public/Granted literature
- US20100115746A1 SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-05-13
Information query