Invention Grant
- Patent Title: Silicon manufacturing apparatus
- Patent Title (中): 硅制造装置
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Application No.: US10569149Application Date: 2004-08-17
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Publication No.: US07993455B2Publication Date: 2011-08-09
- Inventor: Junichirou Nakashima , Hiroyuki Oda
- Applicant: Junichirou Nakashima , Hiroyuki Oda
- Applicant Address: JP
- Assignee: Tokuyama Corporation
- Current Assignee: Tokuyama Corporation
- Current Assignee Address: JP
- Agency: The Webb Law Firm
- Priority: JP2003-298641 20030822
- International Application: PCT/JP2004/011774 WO 20040817
- International Announcement: WO2005/019106 WO 20050303
- Main IPC: C30B21/02
- IPC: C30B21/02

Abstract:
A polycrystalline silicon production apparatus is provided whereby when deposited silicon is caused to drip down into an underlying collection part by heating the reaction tube inner surface at a temperature equal to or above the melting point of silicon, the silicon melt can be prevented from solidifying at a lower end portion of the reaction tube due to temperature lowering at the lower end portion. When a reaction tube is heated with a high frequency heating coil, the temperature lowering at a lower end portion of the reaction tube is prevented through temperature lowering prevention means which may be an infrared device capable of heating the outer periphery of the lower end portion by means of infrared rays, or which may be a lower end coil that is constituted by a coil near the lower end of the high frequency heating coil and has an increased heating intensity relative to an upper coil.
Public/Granted literature
- US20070034146A1 Silicon manufacturing apparatus Public/Granted day:2007-02-15
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