The present invention relates to a device for carrying out a surface treatment of substrates under vacuum, which comprises a housing (1) comprising chambers (2-5) communicate with a vacuum source, at least one of which chambers serves as vacuum lock to the remaining chambers when surface treatment processes are in progress. The housing (1) is divided into an upper and a lower housing half (6, 7) of which at least one has symmetrically distributed recesses (8). Pivotally mounted between the housing halves (6, 7) is a revolver (9), which comprises recesses (10) in which substrate to be treated is placed. The housing halves (6, 7) are designed to be in two positions, in the first of which they are separated from the revolver (9) and in the second of which they are in contact therewith. In the first position the revolver (9) is designed to be turned to predefined rotational positions at which recesses in the housing halves (6, 7) and the revolver (9) coincide in the chambers (2-5). In the first position the vacuum lock can be opened and evacuated without disturbing the vacuum in other parts of the housing (1).