Invention Grant
US07993457B1 Deposition sub-chamber with variable flow 有权
具有可变流量的沉积子室

Deposition sub-chamber with variable flow
Abstract:
An apparatus and method for depositing film on a substrate includes a plurality of conduits that allow by-product and reactant gases to flow past the edge of a substrate. The apparatus and process of the present invention has several advantages for enhanced chamber performance, particularly for micro-volume chambers using pulsed deposition layer processes.
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