Invention Grant
- Patent Title: Two-component structural adhesive having high initial adhesion
- Patent Title (中): 双组分结构粘合剂具有高初始粘合力
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Application No.: US11384184Application Date: 2006-03-17
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Publication No.: US07993484B2Publication Date: 2011-08-09
- Inventor: Friedhelm Koepnick , Martin Majolo , Horst Beck
- Applicant: Friedhelm Koepnick , Martin Majolo , Horst Beck
- Applicant Address: DE Duesseldorf
- Assignee: Henekl AG & Co. KGaA
- Current Assignee: Henekl AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Priority: DE10343090 20030917
- Main IPC: C09J4/00
- IPC: C09J4/00 ; C08L1/00 ; C08L3/00 ; C08L5/00 ; C09D103/00 ; D21H19/54 ; C09D105/00
Abstract:
Two-component assembly adhesives with high early tack, with component A containing 0.5 to 50% of polysaccharides, water, and water-soluble salt, and component B containing water, water-soluble salt, and polysaccharides, the adhesive also containing a water-soluble, water-dispersible polymer.
Public/Granted literature
- US20060157196A1 Two-component structural adhesive having high initial adhesion Public/Granted day:2006-07-20
Information query
IPC分类:
