Invention Grant
- Patent Title: Apparatus and method of electrolytic removal of metals from a wafer surface
- Patent Title (中): 从晶片表面电解去除金属的装置和方法
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Application No.: US11834971Application Date: 2007-08-07
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Publication No.: US07993498B2Publication Date: 2011-08-09
- Inventor: Hariklia Deligianni , Laertis Economikos , Catherine Ivers , Xiaoyan Shao
- Applicant: Hariklia Deligianni , Laertis Economikos , Catherine Ivers , Xiaoyan Shao
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Jennifer R. Davis
- Main IPC: C25D17/00
- IPC: C25D17/00
Abstract:
An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.
Public/Granted literature
- US20090038960A1 APPARATUS AND METHOD OF ELECTROLYTIC REMOVAL OF METALS FROM A WAFER SURFACE Public/Granted day:2009-02-12
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