Invention Grant
- Patent Title: Profiled insulation LAN cables
- Patent Title (中): 异型绝缘LAN电缆
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Application No.: US11260871Application Date: 2005-10-27
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Publication No.: US07993568B2Publication Date: 2011-08-09
- Inventor: Greg Heffner
- Applicant: Greg Heffner
- Applicant Address: FR Paris
- Assignee: Nexans
- Current Assignee: Nexans
- Current Assignee Address: FR Paris
- Agency: Sofer & Haroun, LLP
- Main IPC: B29C59/00
- IPC: B29C59/00 ; D01D5/20 ; D01D5/24 ; H01B3/30

Abstract:
A device for making a profiled insulation having an extrusion die with an extrusion tip and a polymer chamber surrounding the extrusion tip. The polymer chamber has at least one air chamber therein. The air chamber is held in place and coupled to the outside of the extrusion die by a vertical fin extending outwards from the extrusion tip. When molten polymer flows through the polymer chamber around the air chamber, an opening is introduced into the polymer such that the profiled insulation is formed as the polymer exits the extrusion die, having a longitudinal cavity therein corresponding to the location of the opening formed by the at least one air chamber.
Public/Granted literature
- US20070098940A1 Profiled insulation LAN cables Public/Granted day:2007-05-03
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