Invention Grant
- Patent Title: Heat shrinkable multilayer film and packaging material using the same
- Patent Title (中): 热收缩多层膜和使用其的包装材料
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Application No.: US12223958Application Date: 2007-01-15
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Publication No.: US07993713B2Publication Date: 2011-08-09
- Inventor: Hitoshi Ishii , Seiichi Ibe , Tadayoshi Itoh , Shigeyoshi Nakaki
- Applicant: Hitoshi Ishii , Seiichi Ibe , Tadayoshi Itoh , Shigeyoshi Nakaki
- Applicant Address: JP Tokyo
- Assignee: Kureha Corporation
- Current Assignee: Kureha Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-039434 20060216
- International Application: PCT/JP2007/050407 WO 20070115
- International Announcement: WO2007/094144 WO 20070823
- Main IPC: B65B53/00
- IPC: B65B53/00 ; F16B4/00

Abstract:
A heat shrinkable multilayer film comprising an outer surface layer (a) formed of a thermoplastic resin, a first intermediate layer (b1) formed of a polyamide resin, a second intermediate layer (b2) formed of a saponified product of an ethylene-vinyl acetate copolymer, and an inner surface layer (c) formed of a polyolefin resin, whereinthe shrink of the heat shrinkable multilayer film in water at 90° C. is within a range of from 3 to 45% in each of machine and transverse directions, andthe polyamide resin is a mixture of 60 to 90% by weight of an aliphatic polyamide having a melting point of 210° C. or higher and 10 to 40% by weight of an aromatic polyamide comprising isophthalic acid and terephthalic acid as main components.
Public/Granted literature
- US20090136726A1 Heat Shrinkable Multilayer Film and Packaging Material Using the Same Public/Granted day:2009-05-28
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