Invention Grant
- Patent Title: Insulation for high temperature applications
- Patent Title (中): 绝缘用于高温应用
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Application No.: US11801247Application Date: 2007-05-09
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Publication No.: US07993724B2Publication Date: 2011-08-09
- Inventor: Jacob Chacko , Robert P. Collier , Edward A. Martine
- Applicant: Jacob Chacko , Robert P. Collier , Edward A. Martine
- Applicant Address: US OH Toledo
- Assignee: Owens Corning Intellectual Capital, LLC
- Current Assignee: Owens Corning Intellectual Capital, LLC
- Current Assignee Address: US OH Toledo
- Agency: Calfee, Halter & Griswold LLP
- Main IPC: B32B3/00
- IPC: B32B3/00 ; D04H13/00
Abstract:
Insulation for high temperature applications includes glass fibers having an average diameter of between about 2.7 to about 3.8 microns. In one possible embodiment the insulation includes a polyacrylic acid binder. Such insulation has about 98 weight percent glass fibers and about 2 weight percent binder.
Public/Granted literature
- US20080280131A1 Insulation for high temperature applications Public/Granted day:2008-11-13
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