Invention Grant
- Patent Title: Hard surface-veneer engineered surfacing tiles
- Patent Title (中): 硬表面贴面工程铺面砖
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Application No.: US10833880Application Date: 2004-04-28
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Publication No.: US07993731B2Publication Date: 2011-08-09
- Inventor: Robert J. Miller , Jean Briere
- Applicant: Robert J. Miller , Jean Briere
- Applicant Address: US GA Dalton
- Assignee: Shaw Industries Group, Inc.
- Current Assignee: Shaw Industries Group, Inc.
- Current Assignee Address: US GA Dalton
- Agency: Ballard Spahr LLP
- Main IPC: B32B7/02
- IPC: B32B7/02

Abstract:
A modular tile assembly having a substantially rigid substrate, at least one sealant layer, and at least one stone, ceramic, or porcelain tile. A bottom surface of a first sealant layer being bonded to an upper surface of the substrate and a top surface of a second sealant layer being bonded to a lower surface of the substrate. The tile being bonded to at least a portion of the top surface of the first sealant layer. In one example, the substrate is provided with a tongue or a groove defined in any one, combination, or each of the respective side edges of the substrate, as desired.
Public/Granted literature
- US20060154015A1 Hard surface-veneer engineered surfacing tiles and methods Public/Granted day:2006-07-13
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