Invention Grant
- Patent Title: DC and RF hybrid processing system
- Patent Title (中): DC和RF混合处理系统
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Application No.: US12887576Application Date: 2010-09-22
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Publication No.: US07993937B2Publication Date: 2011-08-09
- Inventor: Lee Chen , Merritt Funk
- Applicant: Lee Chen , Merritt Funk
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; G01R31/26
Abstract:
The invention can provide apparatus and methods for processing substrates and/or wafers in real-time using at least one Direct Current (DC)/Radio Frequency (RF) Hybrid (DC/RFH) processing system and associated Direct Current/Radio Frequency Hybrid (DC/RFH) procedures and DC/RFH process parameters and/or DC/RFH models.
Public/Granted literature
- US20110070665A1 DC and RF Hybrid Processing System Public/Granted day:2011-03-24
Information query
IPC分类:
