Invention Grant
- Patent Title: Method for manufacturing light-emitting device
- Patent Title (中): 发光装置的制造方法
-
Application No.: US12420183Application Date: 2009-04-08
-
Publication No.: US07993945B2Publication Date: 2011-08-09
- Inventor: Hisao Ikeda , Takahiro Ibe
- Applicant: Hisao Ikeda , Takahiro Ibe
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Husch Blackwell LLP
- Priority: JP2008-103425 20080411
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/20

Abstract:
An object is to provide a method for manufacturing a light-emitting device with high definition, high light-emitting characteristics, and the long lifetime by employing a method in which a desired evaporation pattern can be formed and an excess evaporation of a material layer which is to be the transfer layer is prevented and in which deterioration of the material or the like is hard to occur in a transfer step. This is a method for manufacturing a light-emitting device, in which irradiation with first light is performed to pattern a material layer over a first substrate which is an evaporation donor substrate and irradiation with second light is performed to evaporate the material layer patterned onto a second substrate which is a deposition target substrate.
Public/Granted literature
- US20090280589A1 Method for Manufacturing Light-Emitting Device Public/Granted day:2009-11-12
Information query
IPC分类: