Invention Grant
US07993965B2 Process for producing semiconductive porcelain composition/electrode assembly 有权
生产半导体陶瓷组合物/电极组件的方法

  • Patent Title: Process for producing semiconductive porcelain composition/electrode assembly
  • Patent Title (中): 生产半导体陶瓷组合物/电极组件的方法
  • Application No.: US12920377
    Application Date: 2009-03-12
  • Publication No.: US07993965B2
    Publication Date: 2011-08-09
  • Inventor: Kentaro InoTakeshi Shimada
  • Applicant: Kentaro InoTakeshi Shimada
  • Applicant Address: JP Tokyo
  • Assignee: Hitachi Metals, Ltd.
  • Current Assignee: Hitachi Metals, Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Stein McEwen, LLP
  • Priority: JP2008-082669 20080327
  • International Application: PCT/JP2009/054810 WO 20090312
  • International Announcement: WO2009/119335 WO 20091001
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Process for producing semiconductive porcelain composition/electrode assembly
Abstract:
A semiconductive porcelain composition/electrode assembly which is low in room temperature resistivity of 100 Ω·cm or less and is reduced in change with the passage of time due to energization with regard to the semiconductive porcelain composition in which a part of Ba of BaTiO3 is substituted with Bi—Na and which has a P-type semiconductive component at a crystal grain boundary. Also, there is a process for producing a semiconductive porcelain composition/electrode assembly wherein an electrode is joined to a semiconductive porcelain composition in which a part of Ba of BaTiO3 is substituted with Bi—Na and which has a P-type semiconductive component at a crystal grain boundary, the process including joining the electrode to the semiconductive porcelain composition, followed by conducting a heat treatment at a temperature of from 100° C. to 600° C. for 0.5 hour to 24 hours.
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