Invention Grant
- Patent Title: Assembling substrates that can form 3-D structures
- Patent Title (中): 组装可形成3-D结构的底物
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Application No.: US12825380Application Date: 2010-06-29
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Publication No.: US07993968B2Publication Date: 2011-08-09
- Inventor: Thaddeus John Gabara
- Applicant: Thaddeus John Gabara
- Applicant Address: US NJ Murray Hill
- Assignee: MetaMEMS Corp.
- Current Assignee: MetaMEMS Corp.
- Current Assignee Address: US NJ Murray Hill
- Agent Thaddeus Gabara
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A system is described that connects the surface of a first substrate to the edge of a second substrate. The surfaces of additional substrates can be placed on the remaining edges of the second substrate to form a 3-D structure. Rigid support substrates can be connected to the first substrate to provide support for the first and additional substrates. The second substrate can be used to carry heat, fluids, electrical power or signals between first and additional substrates besides providing a mechanical support.
Public/Granted literature
- US20100258951A1 ASSEMBLING SUBSTRATES THAT CAN FORM 3-D STRUCTURES Public/Granted day:2010-10-14
Information query
IPC分类:
