Invention Grant
US07993977B2 Method of forming molded standoff structures on integrated circuit devices
有权
在集成电路器件上形成模制支架结构的方法
- Patent Title: Method of forming molded standoff structures on integrated circuit devices
- Patent Title (中): 在集成电路器件上形成模制支架结构的方法
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Application No.: US11772452Application Date: 2007-07-02
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Publication No.: US07993977B2Publication Date: 2011-08-09
- Inventor: Frank Hall , James Voelz
- Applicant: Frank Hall , James Voelz
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of transparent material and, after forming the standoff structures, singulating the substantially rectangular sheet of transparent material into a plurality of individual transparent members, each of which comprise at least one of the plurality of standoff structures.
Public/Granted literature
- US20090011544A1 METHOD OF FORMING MOLDED STANDOFF STRUCTURES ON INTEGRATED CIRCUIT DEVICES Public/Granted day:2009-01-08
Information query
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