Invention Grant
- Patent Title: Electronic device and manufacturing method
- Patent Title (中): 电子器件及制造方法
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Application No.: US12106459Application Date: 2008-04-21
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Publication No.: US07993984B2Publication Date: 2011-08-09
- Inventor: Yasuo Yokota , Hisahiko Yoshida
- Applicant: Yasuo Yokota , Hisahiko Yoshida
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-183969 20070713; JP2007-200484 20070801; JP2007-237717 20070913
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
An electronic device including a semiconductor device with a plurality of bump electrodes, a mounting board connected to the semiconductor device, thermally expandable particles, and adhesive. The thermally expandable particles are provided on the sides of the semiconductor device and the surface of the mounting board around a projected area of the semiconductor device. The adhesive is provided on the sides of the semiconductor device and the surface of the mounting board such that it covers the area of thermally expandable particles. This improves the impact resistance of the semiconductor device soldered onto the mounting board, and also facilitates removal of the semiconductor device from the mounting board when the semiconductor device needs repair.
Public/Granted literature
- US20090014873A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD Public/Granted day:2009-01-15
Information query
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