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US07994015B2 NMOS transistor devices and methods for fabricating same 有权
NMOS晶体管器件及其制造方法

NMOS transistor devices and methods for fabricating same
Abstract:
NMOS transistors having controlled channel strain and junction resistance and methods for the fabrication of same are provided herein. In some embodiments, a method for forming an NMOS transistor may include providing a substrate having a p-type silicon region and a gate stack disposed thereon, the gate stack partially defining a source and a drain region; depositing an undoped first silicon layer having a lattice adjusting element atop the p-type silicon region and within the source and the drain regions; and depositing a second silicon layer having a lattice adjusting element and an n-type dopant atop the undoped first silicon layer.
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