Invention Grant
US07994017B2 Method of manufacturing silicon carbide self-aligned epitaxial MOSFET for high powered device applications
有权
制造用于高功率器件应用的碳化硅自对准外延MOSFET的方法
- Patent Title: Method of manufacturing silicon carbide self-aligned epitaxial MOSFET for high powered device applications
- Patent Title (中): 制造用于高功率器件应用的碳化硅自对准外延MOSFET的方法
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Application No.: US12603603Application Date: 2009-10-22
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Publication No.: US07994017B2Publication Date: 2011-08-09
- Inventor: Christopher Harris , Kent Bertilsson , Andrei Konstantinov
- Applicant: Christopher Harris , Kent Bertilsson , Andrei Konstantinov
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A self-aligned, silicon carbide power metal oxide semiconductor field effect transistor includes a trench formed in a first layer, with a base region and then a source region epitaxially regrown within the trench. A window is formed through the source region and into the base region within a middle area of the trench. A source contact is formed within the window in contact with a base and source regions. The gate oxide layer is formed on the source and base regions at a peripheral area of the trench and on a surface of the first layer. A gate electrode is formed on the gate oxide layer above the base region at the peripheral area of the trench, and a drain electrode is formed over a second surface of the first layer.
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