Invention Grant
- Patent Title: Lead free alloy bump structure and fabrication method
- Patent Title (中): 无铅合金凸块结构及制造方法
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Application No.: US12108909Application Date: 2008-04-24
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Publication No.: US07994043B1Publication Date: 2011-08-09
- Inventor: J. Daniel Mis , Glenn A. Rinne
- Applicant: J. Daniel Mis , Glenn A. Rinne
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: Gunnison, McKay & Hodgson, L.L.P.
- Agent Serge J. Hodgson
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method includes forming a patterned resist layer comprising a resist layer opening overlying a bond pad of a substrate. The resist layer opening is at least partially filled with a first solder component layer. A second solder component layer is formed on the first solder component layer. The patterned resist layer is removed. The first solder component layer and the second solder component layer are reflowed to form a lead free binary metal alloy solder bump electrically connected to the bond pad.
Information query
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