Invention Grant
- Patent Title: Curable silicone composition and electronic component
- Patent Title (中): 可固化有机硅组合物和电子元件
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Application No.: US12520899Application Date: 2007-12-14
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Publication No.: US07994246B2Publication Date: 2011-08-09
- Inventor: Yoshitsugu Morita , Tomoko Kato
- Applicant: Yoshitsugu Morita , Tomoko Kato
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2006-346865 20061225
- International Application: PCT/JP2007/074607 WO 20071214
- International Announcement: WO2008/078663 WO 20080703
- Main IPC: C08K5/1515
- IPC: C08K5/1515 ; C08K5/16
Abstract:
A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion.
Public/Granted literature
- US20100063185A1 Curable Silicone Composition and Electronic Component Public/Granted day:2010-03-11
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