Invention Grant
- Patent Title: Adhesive composition for the manufacturing of corrugated paper board
- Patent Title (中): 用于制造瓦楞纸板的粘合剂组合物
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Application No.: US10564927Application Date: 2004-06-25
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Publication No.: US07994252B2Publication Date: 2011-08-09
- Inventor: Phillipe Ceulemans , Olivier Ceulemans
- Applicant: Phillipe Ceulemans , Olivier Ceulemans
- Applicant Address: BE Turnhout
- Assignee: Corrutech
- Current Assignee: Corrutech
- Current Assignee Address: BE Turnhout
- Agency: Arnstein & Lehr LLP
- Agent Jerold I. Schneider
- Priority: BE2003/0411 20030717
- International Application: PCT/BE2004/000093 WO 20040625
- International Announcement: WO2005/007765 WO 20050127
- Main IPC: C09B67/00
- IPC: C09B67/00 ; C08K3/20
Abstract:
An adhesive composition comprising an amount of an adhesive, and an amount of an additive which is selected from the group of homopolymers of acrylic acid, copolymers of acrylic acid and, polyacrylates, polyurethanes, cellulose thickening agent, natural or synthetic gum, natural or synthetic resin, silica or an inorganic mineral having a layered structure.
Public/Granted literature
- US20080207816A1 Adhesive Composition For the Manufacturing of Corrugated Paper Board Public/Granted day:2008-08-28
Information query
