Invention Grant
- Patent Title: Secondary wall forming genes from maize and uses thereof
- Patent Title (中): 来自玉米的次级壁形成基因及其用途
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Application No.: US12138475Application Date: 2008-06-13
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Publication No.: US07994398B2Publication Date: 2011-08-09
- Inventor: Kanwarpal S Dhugga , Robert B Meeley , Carl R Simmons
- Applicant: Kanwarpal S Dhugga , Robert B Meeley , Carl R Simmons
- Applicant Address: US IA Johnston
- Assignee: Pioneer Hi-Bred International, Inc.
- Current Assignee: Pioneer Hi-Bred International, Inc.
- Current Assignee Address: US IA Johnston
- Main IPC: C12N15/82
- IPC: C12N15/82 ; C12N15/63 ; C12N15/09 ; A01H5/00 ; A01H5/10
Abstract:
The present invention provides polynucleotides and related polypeptides of the class of genes involved in maize secondary wall (ZmSCW) formation. The invention provides genomic sequence for the ZmSCW genes. ZmSCW are responsible for controlling plant growth, secondary cell wall development and yield in crop plants.
Public/Granted literature
- US20080313777A1 Secondary Wall Forming Genes From Maize and Uses Thereof Public/Granted day:2008-12-18
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