A set of electrical connector pins for a thermocouple includes two materially similar conductor pairs, each conductor pair having conductors composed of a different material, and carried by an electrically insulating connector housing. The different materials of the conductor pairs provide a partial compensation to the thermocouple EMF developed between the hot junction and the cold junction when engaged thereto for the different type thermocouples. The conductors of each pair are operable to engage with two thermoelement conductors that form a thermocouple of differing types. The thermocouples provide a hot junction electrical interconnection therebetween at one end and are coupled to a cold junction at another end.