A mounting structure includes a first electronic component, a second electronic component, and an adhesive. The first electronic component includes at least one protruding electrode including a protruding member and at least one electrically conductive layer. The protruding member is formed of resin. The at least one electrically conductive layer is disposed on the protruding member. The second electronic component has a facing electrode electrically conductively in contact with the at least one protruding electrode. The adhesive is used to adhere the first electronic component and the second electronic component to each other. The protruding member has a first area and a second area. The first area has the at least one electrically conductive layer provided thereon. The second area does not have the at least one electrically conductive layer provided thereon. The first area of the protruding member is squashed more than the second area.