Invention Grant
- Patent Title: Printed wiring board and method for producing the same
- Patent Title (中): 印刷电路板及其制造方法
-
Application No.: US12409670Application Date: 2009-03-24
-
Publication No.: US07994433B2Publication Date: 2011-08-09
- Inventor: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- Applicant: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP10-272799 19980928; JP10-276010 19980929; JP10-276011 19980929; JP10-290450 19981013; JP10-310445 19981030; JP10-351572 19981210; JP10-354733 19981214; JP10-372274 19981228; JP11-106184 19990414; JP11-187418 19990701
- Main IPC: H01R12/04
- IPC: H01R12/04 ; H05K1/11
Abstract:
A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.
Public/Granted literature
- US20090183904A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME Public/Granted day:2009-07-23
Information query
