Invention Grant
- Patent Title: Square-wave laser bonding
- Patent Title (中): 方波激光键合
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Application No.: US11137869Application Date: 2005-05-25
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Publication No.: US07994449B2Publication Date: 2011-08-09
- Inventor: Jessica Chiu , Lara K. Suh , Arthur Wen
- Applicant: Jessica Chiu , Lara K. Suh , Arthur Wen
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Cardiovascular Systems, Inc.
- Current Assignee: Advanced Cardiovascular Systems, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
The present invention provides a square-wave laser seal pattern made by first directing a laser beam onto an shaft while the shaft is moving in a horizontal direction relative to a laser device so as to create a horizontal laser seal bond segment. Next, with the shaft rotating about a shaft longitudinal axis, the laser beam is directed onto the shaft so as to create a vertical laser seal bond segment. By alternately creating and coupling together a plurality of horizontal and vertical laser seal bond segments, a square-wave laser seal is formed around a circumference of the shaft. The shaft's movement in a horizontal direction relative to a laser beam may be either at a constant speed or a variable speed so as to control the amount of laser energy heat impacting the shaft material.
Public/Granted literature
- US20050211679A1 Square-wave laser bonding Public/Granted day:2005-09-29
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