Invention Grant
- Patent Title: Laser beam machining apparatus
- Patent Title (中): 激光束加工设备
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Application No.: US12006565Application Date: 2008-01-03
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Publication No.: US07994452B2Publication Date: 2011-08-09
- Inventor: Taiki Sawabe , Keiji Nomaru
- Applicant: Taiki Sawabe , Keiji Nomaru
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2007-003780 20070111
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/38

Abstract:
A laser beam machining apparatus including a beam oscillator; a beam adjusting unit disposed between the beam oscillator and a condenser lens and by which the beam diameter and the divergence angle of the beam oscillated from the beam oscillator are adjusted; and a beam diameter and divergence angle detecting unit for detecting the beam diameter and the divergence angle of the beam having passed through the beam adjusting unit. The apparatus further includes a control unit which computes the beam diameter and the divergence angle of the beam, based on detection signals from the beam diameter and divergence angle detecting unit, and which controls the beam adjusting unit, based on the computed beam diameter and divergence angle of the beam and the beam diameter and the divergence angle of the laser beam incident on the beam diameter and divergence angle detecting unit.
Public/Granted literature
- US20080169274A1 Laser beam machining apparatus Public/Granted day:2008-07-17
Information query
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